- Full turn-key manufacturing
- Integrated global manufacturing facilities
- State- of- the- art technologies and sites
- Highly skilled team
- Customer service focus
- Design for Excellence (DFX)
- Design for Manufacturability (DFM)
- World-class process control & data collection
- Low-mid volume, mid-high mix electronics manufacturing
- Hybrids and custom micro-electronic assemblies
- Dedicated development process from prototyping to production
- Complete mechanical assembly & configuration
- Dedicated NPI center
- Quick-turn prototyping
- 01005 components
- Box Build & System Integration
- Enclosure system configuration
- Complete assembly, inspection, and test
- Traceability
- Flex circuit assembly & test
- RF assembly and test
- Fiber optics assembly & test
- Precision electromechanical assembly
- Final product configuration
- NPI process & prototyping
- Cable & wire routing/installation
- RF assembly and test
- Dedicated system assembly and box build services
- Dedicated NPI center
- Quick-turn prototyping
- 01005 components
- Box Build & System Integration
- Enclosure system configuration
- Complete assembly, inspection, and test
- Fine pitch and high count
- BGAs
- Package on Package (PoP)
- Chip on Board
- RF microelectronics
- Press fit connectors
- Precision Machining
- Flexible lines for high mix production and high volume requirements
- In-house boards, cables, and enclosures
- Global state-of-the –art facilities
- Wafer sawing
- Precision die placement
- In-circuit test (CT)
- Inspection and testing: SPI, AOI, Flying probe and X-Ray
- Liquid Crystal Polymer (LCP)
- Automated wire bonding
- Material dispensing
- Multi-chip assemblies
- Simple cable assemblies through to complex unit assemblies
- Final product build including unique configuration available.
- Single prototypes to full flow line assembly
- Fully automatic Cut and Strip
- Semi-automatic strip and crimp
- Full unit to unit serial number tracking available
- SMT Lines offer a highly flexible pick and place platforms
- Dedicated NPI and fast track line help clients’ achieve production goals
- SMT offers higher density and more connections per component
- Fully automated placement down to 01005, 0.15mm pitch, 0.2mm Micro BGA alongside complex odd form capability
- Fully automated Package on Package (POP)
- Convection and vapor phase reflow
- 100% Automatic Optical Inspection (AOI) on all SMT
- Hi-Power, multi axis color x-ray (including CT scan
- Ersa-scope
- Standalone closed loop rework stations (PDR) for complex rework
- Fully ESD and MSL compliant
- Rework operators IPC7711 / 7721 certified
- Fully automatic Conformal Coating
- Potting and encapsulation
- Closed loop jet spray and emersion cleaning capabilities with contamination measurement
- Low biological contaminate assembly area
- Custom cables
- Wiring harnesses
- Molding harnesses
- High-speed, RF and optical cables
- Electronic drawings and documentation
- Tooling, applicators wide range and test development
- Quick turn product support
- Simple Discrete Wire
- Medical Harnesses
- Automotive Complex
- Quick-turn management
- Multiple manufacturing sites
- Efficient manufacturing process
- Design for manufacturing (DFM)
- Quality inspection services
- Manufacturing execution system (MES)
- Product life cycle management
- Revision control
- Root cause analysis
- After service support; long product life cycle support
Flex & Rigid Flex Circuits
- Design & fabrication
- Single & Double-sided
- Dual access
- Multi-layer
- Rigid flex
- Quick-turn 3-5 day turns
- Volume manufacturing and assembly
- Consignment assembly
- Quick-turn solutions
- Hybrid services
- Long length flex circuits
- Design for Manufacturability (DFM)
- Liquid crystal polymer (LCP) hybrid constructions
- Sensor flex designs
- Sculptured flex circuit leads
- High speed, low loss materials
- Quick-turn prototypes through mass production with assembly
- Flex or complete assemblies- SMT or through hole
- Hybrid constructions consisting of rigid and flexible laminated materials made into a single structure
- Assembly continuity or full functional testing
- Circuit design
- 3 SMT lines 50K components/hour
- 01005 component placement
- Consignment or full turnkey
- CCGA, COB, MCM, MEM
- TSSOP BGA
- Chip Scale Package (CSP), Flip chips, SOIC
- Flying Probe, Universal Grid, and Dedicated Test Systems
- In-house test program generation and fixture manufacturing
- 0.35 mm pitch BGA with X-ray inspection
- IPC 9252 class 1,2,& 3 testing
- Impedance testing
- Hipot testing
- DFM review
- EMI designs/shielding
- Wire bondable flex
- LDI
- Multilayer flex, rigid flex to 18 layers
- Heater flex circuits
- High speed, low loss circuits, Impedance Control designs
- High current, high power applications
- Fine lines and spaces (50 microns in production)
- HDI capabilities – 50 Micros vias, Via in pad, blind and buried vias
- Sculptured flex
- Long length Flex circuits
- Sensor flex designs
- Various Hybrid constructions
- LDI
- Laser drilling
- Conformal coating
- SMT lines, 01005 component placement
- In-house test program and fixture manufacturing
- Platings and finishes:
- Electro-less, electrolytic
- ENEPIG
- Selective/button plating
- Gold (hard and soft) Nickel, tin
- HASL, OSP
- Full in-house reliability and failure analysis capabilities
- Functional test capabilities: connectorized, digital & analog product
- Bare and assembled product
- Plating and surface finish analysis
- Mechanical testing: shear, pull, flexure, and tensile
- In- house Scanning Electron Microscope (SEM)
- X-Ray inspection
Visit one of OSI Electronics’ flex divisions:
Scarborough, Ontario, CAN
Santa Clara, CA, USA