Contract Electronics Manufacturing

  • Full turn-key manufacturing 
  • Integrated global manufacturing facilities 
  • State- of- the- art technologies and sites 
  • Highly skilled team 
  • Customer service focus 
  • Design for Excellence (DFX) 
  • Design for Manufacturability (DFM)  
  • World-class process control & data collection 
  • Low-mid volume, mid-high mix electronics manufacturing 
  • Hybrids and custom micro-electronic assemblies 
  • Dedicated development process from prototyping to production 
  • Complete mechanical assembly & configuration 
  • Dedicated NPI center 
  • Quick-turn prototyping 
  • 01005 components 
  • Box Build & System Integration 
  • Enclosure system configuration 
  • Complete assembly, inspection, and test 
  • Traceability
  • Flex circuit assembly & test 
  • RF assembly and test 
  • Fiber optics assembly & test 
  • Precision electromechanical assembly 
  • Final product configuration 
  • NPI process & prototyping 
  • Cable & wire routing/installation 
  • RF assembly and test
  • Dedicated system assembly and box build services 
  • Dedicated NPI center 
  • Quick-turn prototyping 
  • 01005 components 
  • Box Build & System Integration 
  • Enclosure system configuration 
  • Complete assembly, inspection, and test 
  • Fine pitch and high count 
  • BGAs 
  • Package on Package (PoP) 
  • Chip on Board 
  • RF microelectronics 
  • Press fit connectors 
  • Precision Machining 
  • Flexible lines for high mix production and high volume requirements 
  • In-house boards, cables, and enclosures 
  • Global state-of-the –art facilities 
  • Wafer sawing 
  • Precision die placement 
  • In-circuit test (CT) 
  • Inspection and testing: SPI, AOI, Flying probe and X-Ray  
  • Liquid Crystal Polymer (LCP) 
  • Automated wire bonding 
  • Material dispensing 
  • Multi-chip assemblies  
  • Simple cable assemblies through to complex unit assemblies 
  • Final product build including unique configuration available. 
  • Single prototypes to full flow line assembly 
  • Fully automatic Cut and Strip 
  • Semi-automatic strip and crimp 
  • Full unit to unit serial number tracking available
  • SMT Lines offer a highly flexible pick and place platforms 
  • Dedicated NPI and fast track line help clients’ achieve production goals 
  • SMT offers higher density and more connections per component 
  • Fully automated placement down to 01005, 0.15mm pitch, 0.2mm Micro BGA alongside complex odd form capability 
  • Fully automated Package on Package (POP) 
  • Convection and vapor phase reflow 
  • 100% Automatic Optical Inspection (AOI) on all SMT  
  • Hi-Power, multi axis color x-ray (including CT scan   
  • Ersa-scope 
  • Standalone closed loop rework stations (PDR)  for complex rework 
  • Fully ESD and MSL compliant 
  • Rework operators IPC7711 / 7721 certified 
  • Fully automatic Conformal Coating  
  • Potting and encapsulation 
  • Closed loop jet spray and emersion cleaning capabilities with contamination measurement 
  • Low biological contaminate assembly area
  • Custom cables 
  • Wiring harnesses 
  • Molding harnesses 
  • High-speed, RF and optical cables 
  • Electronic drawings and documentation 
  • Tooling, applicators wide range  and test development 
  • Quick turn product support 
  • Simple Discrete Wire 
  • Medical Harnesses 
  • Automotive Complex
  • Quick-turn management 
  • Multiple manufacturing sites  
  • Efficient manufacturing process  
  • Design for manufacturing (DFM) 
  • Quality inspection services 
  • Manufacturing execution system (MES)  
  • Product life cycle management 
  • Revision control 
  • Root cause analysis 
  • After service support; long product life cycle support

Flex & Rigid Flex Circuits 

  • Design & fabrication 
  • Single & Double-sided 
  • Dual access 
  • Multi-layer 
  • Rigid flex 
  • Quick-turn 3-5 day turns 
  • Volume manufacturing and assembly 
  • Consignment assembly 
  • Quick-turn solutions 
  • Hybrid services 
  • Long length flex circuits 
  • Design for Manufacturability (DFM)   
  • Liquid crystal polymer (LCP) hybrid constructions  
  • Sensor flex designs  
  • Sculptured flex circuit leads 
  • High speed, low loss materials 
  • Quick-­turn prototypes through mass production with assembly 
  • Flex or complete assemblies- SMT or through hole 
  • Hybrid constructions consisting of rigid and flexible laminated materials made into a single structure 
  • Assembly continuity or full functional testing
  • Circuit design 
  • 3 SMT lines 50K components/hour 
  • 01005 component placement  
  • Consignment or full turnkey 
  • CCGA, COB, MCM, MEM 
  • TSSOP BGA 
  • Chip Scale Package (CSP), Flip chips, SOIC 
  • Flying Probe, Universal Grid, and Dedicated Test Systems  
  • In-house test program generation and fixture manufacturing  
  • 0.35 mm pitch BGA with X-ray inspection 
  • IPC 9252 class 1,2,& 3 testing  
  • Impedance testing  
  • Hipot testing 
  • DFM review
  • EMI designs/shielding 
  • Wire bondable flex 
  • LDI 
  • Multilayer flex, rigid flex to 18 layers 
  • Heater flex circuits 
  • High speed, low loss circuits, Impedance Control designs 
  • High current, high power applications 
  • Fine lines and spaces (50 microns in production) 
  • HDI capabilities – 50 Micros vias, Via in pad, blind and buried vias 
  • Sculptured flex 
  • Long length Flex circuits 
  • Sensor flex designs 
  • Various Hybrid constructions
  • LDI 
  • Laser drilling 
  • Conformal coating 
  • SMT lines, 01005 component placement 
  • In-­house test program and fixture manufacturing 
  • Platings and finishes: 
    • Electro-less, electrolytic 
    • ENEPIG 
    • Selective/button plating 
    • Gold (hard and soft) Nickel, tin 
    • HASL, OSP
  • Full in-house reliability and failure analysis capabilities 
  • Functional test capabilities: connectorized, digital & analog product 
  • Bare and assembled product 
  • Plating and surface finish analysis 
  • Mechanical testing: shear, pull, flexure, and tensile 
  • In- house Scanning Electron Microscope (SEM) 
  • X-Ray inspection

Visit one of OSI Electronics’ flex divisions:

Scarborough, Ontario, CAN

Santa Clara, CA, USA