By leveraging our core expertise in technology design and product development, and through our vertical integration and global manufacturing presence, we aim to lead the industry in providing the best, most advanced, and lowest cost products to the world.

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Complete Product Manufacturing

OSI’s long history of vertical integration plus 15 years of operations in Asia, has positioned us well to support complete product manufacturing needs:

  • Global procurement, logistics and supply chain management
  • Electro-mechanical and Box-build capabilities
  • Product test development, programming and fixtures

Quality Systems and Process Control

The heart of OSI’s success is found in our commitment to quality in all aspects of our operations. Each operation is guided to attain the highest levels of system certification needed to support their customer and product base. Highlights of our global quality strategy include.

  • Full ISO certification
  • FDA Registered Operation
  • Full compliance to MIL-I-45208, MIL-PRF-19500, and MIL-STD-883
  • Extensive and continuous employee training and certification programs.
  • Design reviews, product launch, product and process improvement teams activities are enhanced by strategically applied statistical process control techniques.

PCB Assembly

With an attention to details, OSI’s board assembly operations are tailored to allow exceptional flexibility to handle the varying process demands that our customers require. At the same time, our continuing ISO certifications demonstrate our commitment to quality in all products and processes.

Our systems are built around the following capabilities:

  • Automated Surface-Mount Technology
  • Fine-pitch, BGA and uBGA component placement
  • Automated Optical inspection to increase output and reliability and reduce need for In-Circuit Testing
  • 0201 size components to 2” x 2” QFP’s
  • Rapid Prototyping and Product Launch
  • Design for Manufacturability Analysis
  • Custom functional test development
  • Seamless transfer to low cost operations

Hybrids and Custom Micro-Electronics Assemblies

Custom designs developed for medical, security, military, telecommunication, aviation and space applications have been the backbone of our module and hybrid manufacturing activity for nearly 30 years. With the ability to choose between a variety of technologies OSI can offer a solution to almost any packaging challenge.

Some of the key building blocks in our technology include:

  • Thin and thick film chip and wire
  • Thick film SMT with automated equipment
  • On board chip and wire
  • High precision placement
  • Extensive environmental, electrical, optical and functional testing capabilities